Chemical content 74HC132BQ

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Type numberPackagePackage descriptionTotal product weight
74HC132BQSOT762-1DHVQFN1421.81314 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9356907241157126030 s123520 s3Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001181.000000.00541
FillerSilver (Ag)7440-22-40.0885075.000000.40572
PolymerAcrylic resinProprietary0.007086.000000.03246
Resin systemProprietary0.0212418.000000.09737
DieDoped siliconSilicon (Si)7440-21-30.19791100.000000.90730
Lead FrameCopper alloyCopper (Cu)7440-50-88.4266896.1950038.63122
Iron (Fe)7439-89-60.205522.346100.94218
Phosphorus (P)7723-14-00.002650.030200.01213
Zinc (Zn)7440-66-60.008890.101500.04076
Pure metal layerGold (Au)7440-57-50.002650.030200.01213
Nickel (Ni)7440-02-00.106921.220500.49014
Palladium (Pd)7440-05-30.004910.056000.02249
Silver (Ag)7440-22-40.001800.020500.00823
Mould CompoundAdditiveNon hazardousProprietary0.378552.984001.73542
FillerSilica -amorphous-7631-86-90.442743.490002.02970
Silica fused60676-86-010.7602784.8200049.32928
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.127111.002000.58274
PigmentCarbon black1333-86-40.020810.164000.09538
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.469513.701002.15241
Epoxy resin systemProprietary0.201201.586000.92238
Phenolic resinProprietary0.285822.253001.31029
WirePure metalCopper (Cu)7440-50-80.0494696.550000.22675
Pure metal layerGold (Au)7440-57-50.000180.350000.00082
Palladium (Pd)7440-05-30.001593.100000.00728
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.