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Chemical content 74HC4067BQ

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Type numberPackagePackage descriptionTotal product weight
74HC4067BQSOT815-1DHVQFN2451.00608 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352846811181612601235Suzhou, China; Nijmegen, Netherlands; Shanghai, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1018880.100000.19974
PolymerResin systemProprietary0.0253119.900000.04962
subTotal0.12719100.000000.24936
DieDoped siliconSilicon (Si)7440-21-31.19350100.000002.33991
subTotal1.19350100.000002.33991
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.0783297.4700037.40401
Iron (Fe)7439-89-60.469762.400000.92100
Phosphorus (P)7723-14-00.005870.030000.01151
Zinc (Zn)7440-66-60.019570.100000.03837
subTotal19.57353100.0000038.37489
Mould CompoundAdditiveNon hazardousProprietary0.858522.910001.68317
FillerSilica -amorphous-7631-86-91.029633.490002.01865
Silica fused60676-86-025.0239484.8200049.06071
PigmentCarbon black1333-86-40.047200.160000.09255
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.318631.080000.62468
Epoxy resin systemProprietary0.469091.590000.91967
Phenolic resinProprietary0.663802.250001.30142
Tetramethylbiphenyl diglycidyl ether85954-11-61.091593.700002.14012
subTotal29.50241100.0000057.84097
Pre-PlatingPure metal layerGold (Au)7440-57-50.004971.000000.00974
Nickel (Ni)7440-02-00.4521491.000000.88645
Palladium (Pd)7440-05-30.039758.000000.07793
subTotal0.49686100.000000.97412
WirePure metalCopper (Cu)7440-50-80.1087196.550000.21314
Pure metal layerGold (Au)7440-57-50.000390.350000.00077
Palladium (Pd)7440-05-30.003493.100000.00684
subTotal0.11260100.000000.22075
total51.00608100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.