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Chemical content 74LV1T125GV

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Type numberPackagePackage descriptionTotal product weight
74LV1T125GVSOT753SO510.39452 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935690904125612601235Nijmegen, Netherlands; Seremban, Malaysia; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0075075.000000.07215
PolymerResin systemProprietary0.0025025.000000.02405
subTotal0.01000100.000000.09620
DieDoped siliconSilicon (Si)7440-21-30.07216100.000000.69417
subTotal0.07216100.000000.69417
Lead FrameCopper alloyCopper (Cu)7440-50-83.1906694.9600030.69556
Iron (Fe)7439-89-60.085682.550000.82428
Lead (Pb)7439-92-10.001010.030000.00970
Phosphorus (P)7723-14-00.005040.150000.04849
Tin (Sn)7440-31-50.006720.200000.06465
Pure metal layerSilver (Ag)7440-22-40.070902.110000.68205
subTotal3.36000100.0000032.32473
Mould CompoundFillerSilica fused60676-86-04.6008071.0000044.26178
PigmentCarbon black1333-86-40.019440.300000.18702
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2765619.7000012.28109
Phenolic resinProprietary0.583209.000005.61065
subTotal6.48000100.0000062.34054
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00013
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000020.005000.00021
Tin solderTin (Sn)7440-31-50.4399699.990004.23258
subTotal0.44000100.000004.23300
WireGold alloyGold (Au)7440-57-50.0320499.000000.30825
Palladium (Pd)7440-05-30.000321.000000.00311
subTotal0.03236100.000000.31136
total10.39452100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.