×

Chemical content 74LVC1G384GW-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC1G384GW-Q100SOT353-1UMT55.51180 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935300457125512601235Nijmegen, Netherlands; Bangkok, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0075075.000000.13607
PolymerResin systemProprietary0.0025025.000000.04536
subTotal0.01000100.000000.18143
DieDoped siliconSilicon (Si)7440-21-30.09814100.000001.78054
subTotal0.09814100.000001.78054
Lead FrameCopper alloyCopper (Cu)7440-50-81.9034196.6200034.53344
Iron (Fe)7439-89-60.041962.130000.76129
Phosphorus (P)7723-14-00.000590.030000.01072
Zinc (Zn)7440-66-60.002560.130000.04646
MetallisationSilver (Ag)7440-22-40.021471.090000.38958
subTotal1.97000100.0000035.74149
Mould CompoundAdditiveNon hazardousProprietary0.090192.900001.63631
Triphenylphosphine603-35-00.001560.050000.02821
FillerSilica -amorphous-7631-86-92.2392072.0000040.62557
PigmentCarbon black1333-86-40.001560.050000.02821
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.4665015.000008.46366
Phenol Formaldehyde resin (generic)9003-35-40.3110010.000005.64244
subTotal3.11000100.0000056.42440
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00017
Bismuth (Bi)7440-69-90.000000.001000.00006
Copper (Cu)7440-50-80.000000.001000.00006
Lead (Pb)7439-92-10.000020.005000.00028
Tin solderTin (Sn)7440-31-50.3099799.990005.62373
subTotal0.31000100.000005.62430
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0136699.990000.24783
subTotal0.01366100.000000.24785
total5.51180100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.