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Chemical content 74LVC1G66GN

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Type numberPackagePackage descriptionTotal product weight
74LVC1G66GNSOT1115X2SON60.87693 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935291791132712601235Seremban, Malaysia; Nijmegen, Netherlands; Hsin-chu, Taiwan; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.03680100.000004.19673
subTotal0.03680100.000004.19673
ComponentAdditiveNon hazardousProprietary0.000255.000000.02851
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02851
Silica -amorphous-7631-86-90.0025050.000000.28509
PolymerEpoxy resin systemProprietary0.0015030.000000.17105
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05702
subTotal0.00500100.000000.57018
Lead FrameCopper alloyCopper (Cu)7440-50-80.3638694.5100041.49288
Magnesium (Mg)7439-95-40.000580.150000.06585
Nickel (Ni)7440-02-00.011362.950001.29514
Silicon (Si)7440-21-30.002460.640000.28098
Pure metal layerGold (Au)7440-57-50.000080.020000.00878
Nickel (Ni)7440-02-00.006311.640000.72001
Palladium (Pd)7440-05-30.000350.090000.03951
subTotal0.38500100.0000043.90315
Mould CompoundAdditiveNon hazardousProprietary0.001780.410000.20338
FillerSilica -amorphous-7631-86-90.001260.290000.14385
Silica fused60676-86-00.3747586.1500042.73460
HardenerPhenolic resinProprietary0.018664.290002.12805
PigmentCarbon black1333-86-40.000830.190000.09425
PolymerEpoxy resin systemProprietary0.037718.670004.30074
subTotal0.43500100.0000049.60487
WireGold alloyGold (Au)7440-57-50.0149799.000001.70752
Palladium (Pd)7440-05-30.000151.000000.01725
subTotal0.01512100.000001.72477
total0.87693100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.