Chemical content BUK7S0R7-40H

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Type numberPackagePackage descriptionTotal product weight
BUK7S0R7-40HSOT1235LFPAK88346.97000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9346605621185126030 s126020 s3Hsin-chu, Taiwan; Cabuyao, Philippines; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-32.80000100.000000.80699
ClipCopper alloyCopper (Cu)7440-50-847.1339299.8600013.58444
Iron (Fe)7439-89-60.051920.110000.01496
Phosphorus (P)7723-14-00.014160.030000.00408
Lead FrameCopper alloyCopper (Cu)7440-50-8172.9275699.8600049.83934
Iron (Fe)7439-89-60.225120.130000.06488
Phosphorus (P)7723-14-00.051950.030000.01497
Mould CompoundFillerSilica fused60676-86-063.3330062.0000018.25316
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-215.8332515.500004.56329
ImpuritySilicon Dioxide (SiO2)14808-60-70.204300.200000.05888
PigmentCarbon black1333-86-40.510750.500000.14720
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-72.043002.000000.58881
Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-211.2365011.000003.23846
Phenolic resinProprietary8.989208.800002.59077
Post-PlatingImpurityNon hazardousProprietary0.000490.010000.00014
Tin alloyTin (Sn)7440-31-54.8795199.990001.40632
Solder PasteImpurityAntimony (Sb)7440-36-00.003550.030000.00102
Lead alloyLead (Pb)7439-92-110.9299592.470003.15011
Silver (Ag)7440-22-40.295502.500000.08517
Tin (Sn)7440-31-50.591005.000000.17033
Solder PasteImpurityAntimony (Sb)7440-36-00.001980.040000.00057
Lead alloyLead (Pb)7439-92-14.5772692.470001.31921
Silver alloySilver (Ag)7440-22-40.123752.500000.03567
Tin alloyTin (Sn)7440-31-50.247505.000000.07133
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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