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Chemical content NX138BKS

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Type numberPackagePackage descriptionTotal product weight
NX138BKSSOT363SC-885.47341 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934070156135212601235Hsin-chu, Taiwan; Dongguan, China; D-22529 HAMBURG, Germany; Seremban, Malaysia 
934070156115312601235Dongguan, China; Seremban, Malaysia; Hsin-chu, Taiwan; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.10000100.000001.82701
subTotal0.10000100.000001.82701
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001860.090000.03404
Carbon (C)7440-44-00.000830.040000.01513
Chromium (Cr)7440-47-30.004350.210000.07942
Cobalt (Co)7440-48-40.008900.430000.16262
Iron (Fe)7439-89-60.9811847.4000017.92630
Manganese (Mn)7439-96-50.017600.850000.32146
Nickel (Ni)7440-02-00.7392035.7100013.50524
Phosphorus (P)7723-14-00.000410.020000.00756
Silicon (Si)7440-21-30.005380.260000.09833
Sulphur (S)7704-34-90.000410.020000.00756
Pure metal layerCopper (Cu)7440-50-80.2713813.110004.95810
Silver (Ag)7440-22-40.038501.860000.70344
subTotal2.07000100.0000037.81920
Mould CompoundAdditiveNon hazardousProprietary0.084682.900001.54712
Triphenylphosphine603-35-00.001460.050000.02667
FillerSilica -amorphous-7631-86-92.1024072.0000038.41116
PigmentCarbon black1333-86-40.001460.050000.02667
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.4380015.000008.00232
Phenol Formaldehyde resin (generic)9003-35-40.2920010.000005.33488
subTotal2.92000100.0000053.34882
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00020
Bismuth (Bi)7440-69-90.000000.001000.00007
Copper (Cu)7440-50-80.000000.001000.00007
Lead (Pb)7439-92-10.000020.005000.00034
Tin solderTin (Sn)7440-31-50.3699699.990006.75928
subTotal0.37000100.000006.75996
WirePure metalCopper (Cu)7440-50-80.01341100.000000.24500
subTotal0.01341100.000000.24500
total5.47341100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.