Chemical content PMEG2010EPK-Q

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Type numberPackagePackage descriptionTotal product weight
PMEG2010EPK-QSOD1608SOD16081.82808 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934666545315112601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000201.000000.01094
FillerSilver (Ag)7440-22-40.0168084.000000.91900
PolymerBismaleimidodiphenylmethane resin 0.0020010.000000.10940
Isobornyl Methacrylate7534-94-30.001005.000000.05470
DieDoped siliconSilicon (Si)7440-21-30.07000100.000003.82915
Lead FrameCopper alloyCopper (Cu)7440-50-80.9970393.1800054.53952
Magnesium (Mg)7439-95-40.001500.140000.08194
Nickel (Ni)7440-02-00.031032.900001.69741
Silicon (Si)7440-21-30.006740.630000.36875
Pure metal layerGold (Au)7440-57-50.000540.050000.02927
Nickel (Ni)7440-02-00.030282.830001.65644
Palladium (Pd)7440-05-30.002890.270000.15803
Mould CompoundFillerSilica -amorphous-7631-86-90.1242023.000006.79401
Silica fused60676-86-00.3240060.0000017.72351
Flame retardantMetal hydroxideProprietary0.016203.000000.88618
ImpurityBismuth (Bi)7440-69-90.002700.500000.14770
PigmentCarbon black1333-86-40.002700.500000.14770
PolymerEpoxy resin systemProprietary0.037807.000002.06774
Phenolic resinProprietary0.032406.000001.77235
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00022
Non hazardousProprietary0.000050.055500.00273
Tin solderTin (Sn)7440-31-50.0899599.940004.92024
WireImpurityNon hazardousProprietary0.000000.010000.00021
Pure metalGold (Au)7440-57-50.0380899.990002.08285
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.