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Chemical content PMEG6010CPA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG6010CPASOT1061HUSON37.93505 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934064349115612601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001101.000000.01386
FillerSilver (Ag)7440-22-40.0924084.000001.16445
PolymerBismaleimidodiphenylmethane resin 0.0110010.000000.13863
Isobornyl Methacrylate7534-94-30.005505.000000.06931
subTotal0.11000100.000001.38625
DieDoped siliconSilicon (Si)7440-21-30.59000100.000007.43537
subTotal0.59000100.000007.43537
Lead FrameCopper alloyCopper (Cu)7440-50-82.5800192.9400032.51415
Magnesium (Mg)7439-95-40.004720.170000.05947
Nickel (Ni)7440-02-00.086063.100001.08450
Silicon (Si)7440-21-30.019430.700000.24489
Pure metal layerGold (Au)7440-57-50.001110.040000.01399
Nickel (Ni)7440-02-00.077452.790000.97605
Palladium (Pd)7440-05-30.007220.260000.09096
subTotal2.77600100.0000034.98401
Mould CompoundAdditiveNon hazardousProprietary0.017470.410000.22011
FillerSilica -amorphous-7631-86-90.012350.290000.15569
Silica fused60676-86-03.6699986.1500046.25037
HardenerPhenolic resinProprietary0.182754.290002.30312
PigmentCarbon black1333-86-40.008090.190000.10200
PolymerEpoxy resin systemProprietary0.369348.670004.65456
subTotal4.26000100.0000053.68585
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00119
Tin solderTin (Sn)7440-31-50.1699099.940002.14111
subTotal0.17000100.000002.14240
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalCopper (Cu)7440-50-80.0290599.990000.36606
subTotal0.02905100.000000.36610
total7.93505100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.