Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PUMH30

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PUMH30SOT363SC-885.512926 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93405993211515126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.140000100.0000002.539486
subTotal0.140000100.0000002.539486
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0018630.0900000.033793
Carbon (C)7440-44-00.0008280.0400000.015019
Chromium (Cr)7440-47-30.0043470.2100000.078851
Cobalt (Co)7440-48-40.0089010.4300000.161457
Iron (Fe)7439-89-60.98118047.40000017.797808
Manganese (Mn)7439-96-50.0175950.8500000.319159
Nickel (Ni)7440-02-00.73919735.71000013.408433
Phosphorus (P)7723-14-00.0004140.0200000.007510
Silicon (Si)7440-21-30.0053820.2600000.097625
Sulphur (S)7704-34-90.0004140.0200000.007510
Pure metal layerCopper (Cu)7440-50-80.27137713.1100004.922558
Silver (Ag)7440-22-40.0385021.8600000.698395
subTotal2.070000100.00000037.548119
Mould CompoundFillerSilica fused60676-86-02.19292075.10000039.777788
PigmentCarbon black1333-86-40.0087600.3000000.158899
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.51100017.5000009.269125
Phenol Formaldehyde resin (generic)9003-35-40.2073207.1000003.760616
subTotal2.920000100.00000052.966428
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000110.0030000.000201
Bismuth (Bi)7440-69-90.0000040.0010000.000067
Copper (Cu)7440-50-80.0000040.0010000.000067
Lead (Pb)7439-92-10.0000180.0050000.000336
Tin solderTin (Sn)7440-31-50.36996399.9900006.710828
subTotal0.370000100.0000006.711499
WirePure metalCopper (Cu)7440-50-80.012926100.0000000.234463
subTotal0.012926100.0000000.234463
total5.512926100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.