NEVB-LOGIC04 - DIL footprint (XSON / DHXQFN) adapter board
NEVB-LOGIC04 is a dual in-line logic footprint adapter board, designed to simplify the evaluation of Nexperia logic devices by offering several package footprints.
NEVB-LOGIC04 footprint adapter board
Key features & benefits
Plug and play: identify the package you will be using, place the device in the footprint and solder the device down to start evaluating
Packages on the board (5)
| Package | Package name | Package information | Package description | Reference | Date |
|---|---|---|---|---|---|
XSON5 (SOT8065-1) |
XSON5 | SOT8065-1 | Plastic thermal enhanced extremely thin small outline package with side-wettable flanks (SWF); no leads; 5 terminals; body 1.1 × 0.85 × 0.5mm | MO-340 (JEDEC) | 2024-08-27 |
DHXQFN14 (SOT8014-1) |
DHXQFN14 | SOT8014-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package; no leads; 14 terminals; 0.4 mm pitch; body 2 mm x 2 mm x 0.48 mm | 2020-09-22 | |
DHXQFN16 (SOT8016-1) |
DHXQFN16 | SOT8016-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package; no leads; 16 terminals; 0.4 mm pitch; body 2 mm x 2.4 mm x 0.48 mm | 2020-09-22 | |
DHXQFN20 (SOT8020-1) |
DHXQFN20 | SOT8020-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package; no leads; 20 terminals; 0.4 mm pitch; body 2 mm x 3.2 mm x 0.48 mm | 2020-09-22 | |
DHXQFN24 (SOT8024-1) |
DHXQFN24 | SOT8024-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package; no leads; 24 terminals; 0.4 mm pitch; body 2 mm x 4 mm x 0.48 mm | 2020-09-22 |
Related boards (3)
| Board | Description | Type | Quick links | Shop link | |
|---|---|---|---|---|---|
|
NEVB-LOGIC01---DIL-footprint--TSSOP---DHVQFN---XQFN--adapter-board | NEVB-LOGIC01 - DIL footprint (TSSOP / DHVQFN / XQFN) adapter board | Evaluation board | ||
|
NEVB-LOGIC02---DIL-footprint--XSON---X2SON---TSSOP---VSSOP--adapter-board | NEVB-LOGIC02 - DIL footprint (XSON / X2SON / TSSOP / VSSOP) adapter board | Evaluation board | ||
|
NEVB-LOGIC03---DIL-footprint--WLCSP--adapter-board | NEVB-LOGIC03 - DIL footprint (WLCSP) adapter board | Evaluation board |
Packages on the board (5)
| Package | Package name | Package information | Package description | Reference | Date |
|---|---|---|---|---|---|
|
XSON5 (SOT8065-1) |
XSON5 | SOT8065-1 | Plastic thermal enhanced extremely thin small outline package with side-wettable flanks (SWF); no leads; 5 terminals; body 1.1 × 0.85 × 0.5mm | MO-340 (JEDEC) | 2024-08-27 |
|
DHXQFN14 (SOT8014-1) |
DHXQFN14 | SOT8014-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package; no leads; 14 terminals; 0.4 mm pitch; body 2 mm x 2 mm x 0.48 mm | 2020-09-22 | |
|
DHXQFN16 (SOT8016-1) |
DHXQFN16 | SOT8016-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package; no leads; 16 terminals; 0.4 mm pitch; body 2 mm x 2.4 mm x 0.48 mm | 2020-09-22 | |
|
DHXQFN20 (SOT8020-1) |
DHXQFN20 | SOT8020-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package; no leads; 20 terminals; 0.4 mm pitch; body 2 mm x 3.2 mm x 0.48 mm | 2020-09-22 | |
|
DHXQFN24 (SOT8024-1) |
DHXQFN24 | SOT8024-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package; no leads; 24 terminals; 0.4 mm pitch; body 2 mm x 4 mm x 0.48 mm | 2020-09-22 |
Related boards (3)
| Board | Description | Type | Quick links | Shop link | |
|---|---|---|---|---|---|
|
|
NEVB-LOGIC01---DIL-footprint--TSSOP---DHVQFN---XQFN--adapter-board | NEVB-LOGIC01 - DIL footprint (TSSOP / DHVQFN / XQFN) adapter board | Evaluation board | ||
|
|
NEVB-LOGIC02---DIL-footprint--XSON---X2SON---TSSOP---VSSOP--adapter-board | NEVB-LOGIC02 - DIL footprint (XSON / X2SON / TSSOP / VSSOP) adapter board | Evaluation board | ||
|
|
NEVB-LOGIC03---DIL-footprint--WLCSP--adapter-board | NEVB-LOGIC03 - DIL footprint (WLCSP) adapter board | Evaluation board |
Documentation (5)
| File name | Title | Type | Date |
|---|---|---|---|
| SOT8014-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 14 terminals; 0.4 mm pitch; body 2 mm x 2 mm x 0.48 mm | Package information | 2023-02-28 |
| SOT8016-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 16 terminals; 0.4 mm pitch; body 2 mm x 2.4 mm x 0.48 mm | Package information | 2023-02-03 |
| SOT8020-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 20 terminals; 0.4 mm pitch; body 2 mm x 3.2 mm x 0.48 mm | Package information | 2023-02-28 |
| SOT8024-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 24 terminals; 0.4 mm pitch; body 2 mm x 4 mm x 0.48 mm | Package information | 2023-02-28 |
| SOT8065-1 | Plastic thermal enhanced extremely thin small outline package withside-wettable flanks (SWF); no leads; 5 terminals; body 1.1 × 0.85 × 0.5mm | Package information | 2024-09-24 |
Support
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