SOT1269-2

X2SON4 (SOT1269-2)

plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm body

Outline drawing

Package version Package name Package description Reference Issue date
SOT1269-2 X2SON4 plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm body 2017-06-30

Related documents

File name Title Type Date
REFLOW_BG-BD-1 Reflow soldering profile Other type 2017-12-01
XSON4_SOT1269-2_mk plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm body Marcom graphics 2019-02-04
Nexperia_package_poster Nexperia package poster Leaflet 2019-03-01
Nexperia_document_leaflet_Logic_X2SON_packages_062018 X2SON ultra-small 4, 5, 6 & 8-pin leadless packages Leaflet 2018-06-05
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03

Products in this package

Logic
Type number Description Quick access
74AUP1G04GX4 Low-power inverter
74AUP1G07GX4 Low-power buffer with open-drain output
74AUP1G14GX4 Low-power Schmitt trigger inverter
74AUP1G17GX4 Low-power Schmitt trigger
74AUP1G34GX4 Low-power buffer
74LVC1G04GX4 Single inverter
74LVC1G07GX4 Buffer with open-drain output
74LVC1G14GX4 Single Schmitt-trigger inverter
74LVC1G17GX4 Single Schmitt trigger buffer
74LVC1G34GX4 Single buffer