NEVB-LOGIC05 - DIL footprint (X2SON / XSON) adapter board
NEVB-LOGIC05 is a dual in-line logic footprint adapter board, designed to simplify the evaluation of Nexperia logic devices by offering several package footprints.
Key features & benefits
- Plug and play: identify the package you will be using, place the device in the footprint and solder the device down to start evaluating
- Compatible with several packages:
- X2SON4 (SOT1269)
- X2SON5 (SOT1226)
- TSOP6 (SOT457)
- XSON8 (SOT1203)
- DHVQFN14 (SOT762)
- HWQFN24 (SOT8041)
Packages on the board (8)
| Package | Package name | Package information | Package description | Reference | Date |
|---|---|---|---|---|---|
TSOP6 (SOT457) |
TSOP6 | SOT457 | plastic, surface-mounted package (SC-74; TSOP6); 6 leads | SC-74 (EIAJ) | 2006-03-16 |
XSON8 (SOT1203) |
XSON8 | SOT1203 | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | 2010-04-06 | |
X2SON5 (SOT1226) |
X2SON5 | SOT1226 | plastic, leadless thermal enhanced extremely thin small outline package; no leads; 5 terminals; 0.48 mm pitch; 0.8 mm x 0.8 mm x 0.35 mm body | 2012-04-18 | |
X2SON5 (SOT1226-3) |
X2SON5 | SOT1226-3 | plastic thermal enhanced extremely thin small outline package; no leads; 5 terminals; body 0.8 x 0.8 x 0.32 mm | 2019-11-07 | |
HWQFN24 (SOT8041-1) |
HWQFN24 | SOT8041-1 | plastic thermal enhanced very very thin Quad Flat packages, no leads; 24 terminals; 0.5 mm pitch; 4 x 4 x 0.75 mm body | MO-220 (WGGD-8) (JEDEC) | 2022-04-25 |
HWQFN24 (SOT8041-2) |
HWQFN24 | SOT8041-2 | Plastic thermal enhanced very very thin Quad Flat package, no leads; 24 terminals; 0.5 mm pitch; 4.0 mm x 4.0 mm x 0.75 mm body | 2024-12-16 | |
DHVQFN14 (SOT762-1) |
DHVQFN14 | SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | MO-241 (JEDEC) | 2015-05-05 |
X2SON4 (SOT1269-2) |
X2SON4 | SOT1269-2 | plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm body | 2017-06-30 |
Related boards (1)
| Board | Description | Type | Quick links | Shop link | |
|---|---|---|---|---|---|
|
NEVB-LOGIC04---DIL-footprint--XSON---DHXQFN-----adapter-board | NEVB-LOGIC04 - DIL footprint (XSON / DHXQFN) adapter board | Evaluation board | Order |
Packages on the board (8)
| Package | Package name | Package information | Package description | Reference | Date |
|---|---|---|---|---|---|
|
TSOP6 (SOT457) |
TSOP6 | SOT457 | plastic, surface-mounted package (SC-74; TSOP6); 6 leads | SC-74 (EIAJ) | 2006-03-16 |
|
XSON8 (SOT1203) |
XSON8 | SOT1203 | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | 2010-04-06 | |
|
X2SON5 (SOT1226) |
X2SON5 | SOT1226 | plastic, leadless thermal enhanced extremely thin small outline package; no leads; 5 terminals; 0.48 mm pitch; 0.8 mm x 0.8 mm x 0.35 mm body | 2012-04-18 | |
|
X2SON5 (SOT1226-3) |
X2SON5 | SOT1226-3 | plastic thermal enhanced extremely thin small outline package; no leads; 5 terminals; body 0.8 x 0.8 x 0.32 mm | 2019-11-07 | |
|
HWQFN24 (SOT8041-1) |
HWQFN24 | SOT8041-1 | plastic thermal enhanced very very thin Quad Flat packages, no leads; 24 terminals; 0.5 mm pitch; 4 x 4 x 0.75 mm body | MO-220 (WGGD-8) (JEDEC) | 2022-04-25 |
|
HWQFN24 (SOT8041-2) |
HWQFN24 | SOT8041-2 | Plastic thermal enhanced very very thin Quad Flat package, no leads; 24 terminals; 0.5 mm pitch; 4.0 mm x 4.0 mm x 0.75 mm body | 2024-12-16 | |
|
DHVQFN14 (SOT762-1) |
DHVQFN14 | SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | MO-241 (JEDEC) | 2015-05-05 |
|
X2SON4 (SOT1269-2) |
X2SON4 | SOT1269-2 | plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm body | 2017-06-30 |
Related boards (1)
| Board | Description | Type | Quick links | Shop link | |
|---|---|---|---|---|---|
|
|
NEVB-LOGIC04---DIL-footprint--XSON---DHXQFN-----adapter-board | NEVB-LOGIC04 - DIL footprint (XSON / DHXQFN) adapter board | Evaluation board | Order |
Documentation (7)
| File name | Title | Type | Date |
|---|---|---|---|
| SOT1203 | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | Package information | 2022-06-03 |
| SOT1226 | plastic, leadless thermal enhanced extremely thin small outline package; no leads; 5 terminals; 0.48 mm pitch; 0.8 mm x 0.8 mm x 0.35 mm body | Package information | 2022-05-30 |
| SOT1269-2 | plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm body | Package information | 2020-08-18 |
| SOT457 | plastic, surface-mounted package (SC-74; TSOP6); 6 leads | Package information | 2023-03-03 |
| SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
| SOT8041-2 | Plastic thermal enhanced very very thin Quad Flat package,no leads; 24 terminals; 0.5 mm pitch; 4.0 mm x 4.0 mm x 0.75 mm body | Package information | 2025-03-18 |
| nexperia_factsheet_dual_in_line_logic_footprint_adapter_boards | Dual in-line Logic footprint adapter boards | Leaflet | 2026-04-07 |
Support
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