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SOT8025-1

SOT8025-1

wafer level chip-scale package; 16 bumps; 1.455 mm x 1.455 mm x 0.43 mm bod

Package information

Package information Package name Package description Reference Date
SOT8025-1 WLCSP16 wafer level chip-scale package; 16 bumps; 1.455 mm x 1.455 mm x 0.43 mm bod 2021-06-16

Related documents

File name Title Type Date
SOT8025-1 3D model for products with SOT8025-1 package Design support 2023-02-07
SOT8025-1 wafer level chip-scale package; 16 bumps; 1.455 mm x 1.455 mm x 0.43 mm bod Package information 2022-07-08
SOT8025-1_336 WLCSP16; Reel dry pack for SMD, 7"; Q1/T1 product orientation Packing information 2023-03-03

Products in this package

Analog & Logic ICs

Type number Description Quick access
NXS0506UP SD 3.0-compatible memory card integrated auto-direction control and level translator with EMI filter and ESD protection