74CBTLV3126-Q100

4-bit bus switch

The 74CBTLV3126-Q100 provides a 4-bit high-speed bus switch with separate output enable inputs (1OE to 4OE). The low on-state resistance of the switch allows connections to be made with minimal propagation delay. The switch is disabled (high-impedance OFF-state) when the output enable (nOE) input is LOW.

To ensure the high-impedance OFF-state during power-up or power-down, nOE should be tied to the GND through a pull-down resistor. The current-sinking capability of the driver determines the minimum value of the resistor.

Schmitt trigger action at control input makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 2.3 V to 3.6 V.

This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)
    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C
  • Supply voltage range from 2.3 V to 3.6 V
  • Standard ’126’-type pinout
  • High noise immunity
  • Complies with JEDEC standard:
    • JESD8-5 (2.3 V to 2.7 V)
    • JESD8-B/JESD36 (2.7 V to 3.6 V)
  • ESD protection:
    • MIL-STD-883, method 3015 exceeds 2000 V
    • HBM JESD22-A114F exceeds 2000 V
    • MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 Ω)
  • 5 Ω switch connection between two ports
  • Rail to rail switching on data I/O ports
  • CMOS low power consumption
  • Latch-up performance exceeds 250 mA per JESD78B Class I level A
  • IOFF circuitry provides partial Power-down mode operation
  • DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints

Parametrics

Type numberProduct statusVCC (V)RON (Ω)Logic switching levelstpd (ns)Power dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74CBTLV3126BQ-Q100Production2.3 - 3.67CMOS/LVTTL0.2very low-40~12510721.375DHVQFN14
74CBTLV3126PW-Q100Production2.3 - 3.67CMOS/LVTTL0.2very low-40~1251418.068TSSOP14

Package

Type numberPackagePackage informationReflow-/Wave solderingPackingStatusMarkingOrderable part number, (Ordering code (12NC))
74CBTLV3126BQ-Q100
DHVQFN14
(SOT762-1)
SOT762-1Reel 7” Q1/T1 or Q2/T3ActiveV312674CBTLV3126BQ-Q10X
( 9353 009 57115 )
74CBTLV3126PW-Q100
TSSOP14
(SOT402-1)
SOT402-1SSOP-TSSOP-VSO-WAVE
Reel 13" Q1/T1ActiveTLV312674CBTLV3126PW-Q10J
( 9353 009 56118 )

Quality, reliability & chemical content

Type numberOrderable part numberChemical contentRoHS / RHFLeadfree conversion dateEFRMSLMSL leadfree
74CBTLV3126BQ-Q10074CBTLV3126BQ-Q10X74CBTLV3126BQ-Q100Always Pb-free144.911
74CBTLV3126PW-Q10074CBTLV3126PW-Q10J74CBTLV3126PW-Q100Always Pb-free144.911
Quality and reliability disclaimer

Documentation (6)

File nameTitleTypeDate
74CBTLV3126_Q1004-bit bus switchData sheet2020-03-23
cbtlv312674CBTLV3126 IBIS modelIBIS model2015-02-22
Nexperia_Selection_guide_2020Nexperia Selection Guide 2020Selection guide2020-01-31
SOT762-1plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 3 mm x 2.5 mm x 1 mm bodyPackage information2020-04-21
SSOP-TSSOP-VSO-WAVEFootprint for wave solderingWave soldering2009-10-08
SOT402-1plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm bodyPackage information2020-04-21

Support

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Models

File nameTitleTypeDate
cbtlv312674CBTLV3126 IBIS modelIBIS model2015-02-22

Ordering, pricing & availability

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