
74HCS166
Parametrics
Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|---|
74HCS166BQ | 2.0 - 6.0 | CMOS | ± 7.8 | 7 | 220 | 8 | low | -40~125 | DHVQFN16 |
74HCS166D | 2.0 - 6.0 | CMOS | ± 7.8 | 7 | 220 | 8 | low | -40~125 | SO16 |
74HCS166PW | 2.0 - 6.0 | CMOS | ± 7.8 | 7 | 220 | 8 | low | -40~125 | TSSOP16 |
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
74HCS166BQ | 74HCS166BQX (935691473115) |
Active | HCS166 |
![]() DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
74HCS166D | 74HCS166DJ (935691475118) |
Active | 74HCS166D |
![]() SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
74HCS166PW | 74HCS166PWJ (935691476118) |
Active | HCS166 |
![]() TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
74HCS166BQ | 74HCS166BQX | 74HCS166BQ |
|
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74HCS166D | 74HCS166DJ | 74HCS166D |
|
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74HCS166PW | 74HCS166PWJ | 74HCS166PW |
|
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Documentation (16)
File name | Title | Type | Date |
---|---|---|---|
AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
74hcs166 | 74HCS166 IBIS Model | IBIS model | 2025-06-30 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DHVQFN16_SOT763-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
SO16_SOT109-1_mk | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | Marcom graphics | 2017-01-28 |
TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
Support
If you are in need of design/technical support, let us know and fill in the answer form we'll get back to you shortly.
Models
File name | Title | Type | Date |
---|---|---|---|
SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
74hcs166 | 74HCS166 IBIS Model | IBIS model | 2025-06-30 |
Ordering, pricing & availability
Sample
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If you do not have a direct account with Nexperia our network of global and regional distributors is available and equipped to support you with Nexperia samples. Check out the list of official distributors.