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Chemical content 74AHCT30D

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Type numberPackagePackage descriptionTotal product weight
74AHCT30DSOT108-1SO14123.12424 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352641841181412601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0779077.900000.06327
PolymerAcrylic resinProprietary0.0152015.200000.01235
Resin systemProprietary0.006906.900000.00560
subTotal0.10000100.000000.08122
DieDoped siliconSilicon (Si)7440-21-30.15647100.000000.12708
subTotal0.15647100.000000.12708
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-843.4131497.4700035.25962
Iron (Fe)7439-89-61.068962.400000.86820
Phosphorus (P)7723-14-00.013360.030000.01085
Zinc (Zn)7440-66-60.044540.100000.03617
subTotal44.54000100.0000036.17484
Mould CompoundFillerSilica -amorphous-7631-86-90.465540.600000.37811
Silica fused60676-86-060.7762578.3300049.36172
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.732996.100003.84408
PigmentCarbon black1333-86-40.155180.200000.12604
PolymerEpoxy resin systemProprietary6.876038.862005.58462
Phenolic resinProprietary4.584025.908003.72308
subTotal77.59000100.0000063.01765
Pre-PlatingPure metal layerGold (Au)7440-57-50.006701.000000.00544
Nickel (Ni)7440-02-00.6499097.000000.52784
Palladium (Pd)7440-05-30.013402.000000.01088
subTotal0.67000100.000000.54416
WirePure metalCopper (Cu)7440-50-80.06777100.000000.05504
subTotal0.06777100.000000.05504
total123.12424100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.