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Chemical content 74ALVC245BQ

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Type numberPackagePackage descriptionTotal product weight
74ALVC245BQSOT764-1DHVQFN2028.69677 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352855521151212601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.23804
PolymerResin systemProprietary0.0169719.900000.05914
subTotal0.08528100.000000.29718
DieDoped siliconSilicon (Si)7440-21-30.41381100.000001.44200
subTotal0.41381100.000001.44200
DieDoped siliconSilicon (Si)7440-21-30.41164100.000001.43445
subTotal0.41164100.000001.43445
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.5891697.4700036.90018
Iron (Fe)7439-89-60.260742.400000.90859
Phosphorus (P)7723-14-00.003260.030000.01136
Zinc (Zn)7440-66-60.010860.100000.03786
subTotal10.86402100.0000037.85799
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.66050
FillerSilica -amorphous-7631-86-90.571483.490001.99146
Silica fused60676-86-013.8892084.8200048.39987
PigmentCarbon black1333-86-40.026200.160000.09130
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.61627
Epoxy resin systemProprietary0.260361.590000.90728
Phenolic resinProprietary0.368442.250001.28389
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.11129
subTotal16.37491100.0000057.06186
Pre-PlatingPure metal layerGold (Au)7440-57-50.002761.000000.00961
Nickel (Ni)7440-02-00.2509591.000000.87449
Palladium (Pd)7440-05-30.022068.000000.07688
subTotal0.27577100.000000.96098
WirePure metalGold (Au)7440-57-50.1844099.000000.64259
Palladium (Pd)7440-05-30.001861.000000.00649
subTotal0.18626100.000000.64908
WirePure metalCopper (Cu)7440-50-80.0821496.550000.28623
Pure metal layerGold (Au)7440-57-50.000300.350000.00104
Palladium (Pd)7440-05-30.002643.100000.00919
subTotal0.08507100.000000.29646
total28.69677100.00000100.00000
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