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Chemical content 74AUP1G08GW/C7

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Type numberPackagePackage descriptionTotal product weight
74AUP1G08GW/C7SOT353-1UMT55.65451 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691929125212601235Shanghai, China; Hefei, China; Seremban, Malaysia; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0072975.000000.12892
PolymerResin systemProprietary0.0024325.000000.04297
subTotal0.00972100.000000.17189
DieDoped siliconSilicon (Si)7440-21-30.05891100.000001.04185
subTotal0.05891100.000001.04185
Lead FrameCopper alloyCopper (Cu)7440-50-81.9077596.8400033.73852
Iron (Fe)7439-89-60.045512.310000.80479
Lead (Pb)7439-92-10.000200.010000.00348
Phosphorus (P)7723-14-00.001380.070000.02439
Zinc (Zn)7440-66-60.002360.120000.04181
Pure metal layerSilver (Ag)7440-22-40.012800.650000.22646
subTotal1.97000100.0000034.83945
Mould CompoundFillerSilica -amorphous-7631-86-90.4606014.000008.14571
Silica fused60676-86-02.3217570.5700041.06020
PigmentCarbon black1333-86-40.006580.200000.11637
PolymerEpoxy resin systemProprietary0.305649.290005.40526
Phenolic resinProprietary0.195435.940003.45611
subTotal3.29000100.0000058.18365
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00016
Bismuth (Bi)7440-69-90.000000.001000.00005
Copper (Cu)7440-50-80.000000.001000.00005
Lead (Pb)7439-92-10.000020.005000.00027
Tin solderTin (Sn)7440-31-50.3099799.990005.48180
subTotal0.31000100.000005.48233
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0158799.990000.28074
subTotal0.01588100.000000.28077
total5.65451100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.