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Chemical content 74AUP1G34GW/C7

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Type numberPackagePackage descriptionTotal product weight
74AUP1G34GW/C7SOT353-1UMT55.65053 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691930125112601235Bangkok, Thailand; Seremban, Malaysia; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0072975.000000.12901
PolymerResin systemProprietary0.0024325.000000.04300
subTotal0.00972100.000000.17201
DieDoped siliconSilicon (Si)7440-21-30.05891100.000001.04259
subTotal0.05891100.000001.04259
Lead FrameCopper alloyCopper (Cu)7440-50-81.9077596.8400033.76228
Iron (Fe)7439-89-60.045512.310000.80536
Lead (Pb)7439-92-10.000200.010000.00349
Phosphorus (P)7723-14-00.001380.070000.02440
Zinc (Zn)7440-66-60.002360.120000.04184
Pure metal layerSilver (Ag)7440-22-40.012800.650000.22662
subTotal1.97000100.0000034.86399
Mould CompoundFillerSilica -amorphous-7631-86-90.4606014.000008.15145
Silica fused60676-86-02.3217570.5700041.08912
PigmentCarbon black1333-86-40.006580.200000.11645
PolymerEpoxy resin systemProprietary0.305649.290005.40907
Phenolic resinProprietary0.195435.940003.45854
subTotal3.29000100.0000058.22463
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00016
Bismuth (Bi)7440-69-90.000000.001000.00005
Copper (Cu)7440-50-80.000000.001000.00005
Lead (Pb)7439-92-10.000020.005000.00027
Tin solderTin (Sn)7440-31-50.3099799.990005.48566
subTotal0.31000100.000005.48619
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0119099.990000.21053
subTotal0.01190100.000000.21055
total5.65053100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.