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Chemical content 74AUP2G00GM

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Type numberPackagePackage descriptionTotal product weight
74AUP2G00GMSOT902-2XQFN8(U)3.39733 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352814231252012601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China; Ayutthaya, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.010005.000000.29435
FillerAluminium Trioxide (Al2O3)1344-28-10.0800040.000002.35479
PolymerBisphenol A-epichlorohydrin resin25068-38-60.0200010.000000.58870
Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer25036-25-30.0300015.000000.88305
Resin systemProprietary0.0600030.000001.76609
subTotal0.20000100.000005.88698
DieDoped siliconSilicon (Si)7440-21-30.10136100.000002.98337
subTotal0.10136100.000002.98337
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-81.5520097.0000045.68293
Nickel (Ni)7440-02-00.048003.000001.41287
subTotal1.60000100.0000047.09580
Mould CompoundFillerSilica -amorphous-7631-86-90.105007.500003.09066
Silica fused60676-86-01.0871077.6500031.99866
Flame retardantNon hazardousProprietary0.077005.500002.26649
HardenerPhenolic resinProprietary0.049003.500001.44231
PigmentCarbon black1333-86-40.001400.100000.04121
PolymerEpoxy resin systemProprietary0.080505.750002.36951
subTotal1.40000100.0000041.20884
Pre-PlatingPure metal layerGold (Au)7440-57-50.000501.000000.01472
Nickel (Ni)7440-02-00.0485097.000001.42759
Palladium (Pd)7440-05-30.001002.000000.02943
subTotal0.05000100.000001.47174
WirePure metalGold (Au)7440-57-50.0455199.000001.33965
Palladium (Pd)7440-05-30.000461.000000.01353
subTotal0.04597100.000001.35318
total3.39733100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.