Chemical content 74AVCH2T45GF

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Type number	Package	Package description	Total product weight
74AVCH2T45GF	SOT1089	XSON8	1.78794 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
935291498115	8	1	260		1	235			Shanghai, China; Bangkok, Thailand; Suzhou, China; Seremban, Malaysia; Nijmegen, Netherlands; Ayutthaya, Thailand

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Die	Doped silicon	Silicon (Si)	7440-21-3	0.09527	100.00000	5.32869
		subTotal		0.09527	100.00000	5.32869

Component	Additive	Non hazardous	Proprietary	0.00100	5.00000	0.05593
	Filler	Aluminium Trioxide (Al2O3)	1344-28-1	0.00800	40.00000	0.44744
	Polymer	Bisphenol A-epichlorohydrin resin	25068-38-6	0.00200	10.00000	0.11186
		Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer	25036-25-3	0.00300	15.00000	0.16779
		Resin system	Proprietary	0.00600	30.00000	0.33558
		subTotal		0.02000	100.00000	1.11860

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	0.63724	95.11000	35.64085
		Magnesium (Mg)	7439-95-4	0.00134	0.20000	0.07495
		Nickel (Ni)	7440-02-0	0.02124	3.17000	1.18790
		Silicon (Si)	7440-21-3	0.00462	0.69000	0.25857
	Pure metal layer	Gold (Au)	7440-57-5	0.00013	0.02000	0.00749
		Nickel (Ni)	7440-02-0	0.00496	0.74000	0.27730
		Palladium (Pd)	7440-05-3	0.00047	0.07000	0.02623
		subTotal		0.67000	100.00000	37.47329

Mould Compound	Filler	Silica -amorphous-	7631-86-9	0.21620	23.00000	12.09213
		Silica fused	60676-86-0	0.56400	60.00000	31.54468
	Flame retardant	Metal hydroxide	Proprietary	0.02820	3.00000	1.57723
	Impurity	Bismuth (Bi)	7440-69-9	0.00470	0.50000	0.26287
	Pigment	Carbon black	1333-86-4	0.00470	0.50000	0.26287
	Polymer	Epoxy resin system	Proprietary	0.06580	7.00000	3.68021
		Phenolic resin	Proprietary	0.05640	6.00000	3.15447
		subTotal		0.94000	100.00000	52.57446

Post-Plating	Impurity	Antimony (Sb)	7440-36-0	0.00000	0.00300	0.00005
		Bismuth (Bi)	7440-69-9	0.00000	0.00100	0.00002
		Copper (Cu)	7440-50-8	0.00000	0.00100	0.00002
		Lead (Pb)	7439-92-1	0.00000	0.00500	0.00008
	Tin solder	Tin (Sn)	7440-31-5	0.03000	99.99000	1.67774
		subTotal		0.03000	100.00000	1.67791

Wire	Gold alloy	Gold (Au)	7440-57-5	0.03234	99.00000	1.80897
		Palladium (Pd)	7440-05-3	0.00033	1.00000	0.01827
		subTotal		0.03267	100.00000	1.82724

		total		1.78794	100.00000	100.00000

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.