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Chemical content 74AVCH8T245BQ

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Type numberPackagePackage descriptionTotal product weight
74AVCH8T245BQSOT815-1DHVQFN2450.49530 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93528459211812126030 s123520 s3Shanghai, China; Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001271.000000.00252
FillerSilver (Ag)7440-22-40.0953975.000000.18891
PolymerAcrylic resinProprietary0.007636.000000.01511
Resin systemProprietary0.0228918.000000.04534
subTotal0.12719100.000000.25188
DieDoped siliconSilicon (Si)7440-21-30.64392100.000001.27521
subTotal0.64392100.000001.27521
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.0783297.4700037.78237
Iron (Fe)7439-89-60.469762.400000.93031
Phosphorus (P)7723-14-00.005870.030000.01163
Zinc (Zn)7440-66-60.019570.100000.03876
subTotal19.57353100.0000038.76307
Mould CompoundAdditiveNon hazardousProprietary0.880352.984001.74343
FillerSilica -amorphous-7631-86-91.029633.490002.03907
Silica fused60676-86-025.0239484.8200049.55698
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.295611.002000.58543
PigmentCarbon black1333-86-40.048380.164000.09582
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-71.091883.701002.16235
Epoxy resin systemProprietary0.467911.586000.92664
Phenolic resinProprietary0.664692.253001.31634
subTotal29.50241100.0000058.42606
Pre-PlatingPure metal layerGold (Au)7440-57-50.004971.000000.00984
Nickel (Ni)7440-02-00.4521491.000000.89542
Palladium (Pd)7440-05-30.039758.000000.07872
subTotal0.49686100.000000.98398
WirePure metalCopper (Cu)7440-50-80.1461796.550000.28948
Pure metal layerGold (Au)7440-57-50.000530.350000.00105
Palladium (Pd)7440-05-30.004693.100000.00929
subTotal0.15140100.000000.29982
total50.49530100.00000100.00000
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