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Chemical content 74AXP1T32GM

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Type numberPackagePackage descriptionTotal product weight
74AXP1T32GMSOT886XSON61.90302 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691217115512601235Bangkok, Thailand; Seremban, Malaysia; Singapore, Singapore 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.03565100.000001.87329
subTotal0.03565100.000001.87329
ComponentAdditiveNon hazardousProprietary0.000255.000000.01314
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.01314
Silica -amorphous-7631-86-90.0025050.000000.13137
PolymerEpoxy resin systemProprietary0.0015030.000000.07882
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.02627
subTotal0.00500100.000000.26274
Lead FrameCopper alloyCopper (Cu)7440-50-80.7296294.5100038.33996
Magnesium (Mg)7439-95-40.001160.150000.06085
Nickel (Ni)7440-02-00.022772.950001.19673
Silicon (Si)7440-21-30.004940.640000.25963
Pure metal layerGold (Au)7440-57-50.000150.020000.00811
Nickel (Ni)7440-02-00.012661.640000.66530
Palladium (Pd)7440-05-30.000690.090000.03651
subTotal0.77200100.0000040.56709
Mould CompoundAdditiveNon hazardousProprietary0.004370.410000.22967
FillerSilica -amorphous-7631-86-90.003090.290000.16245
Silica fused60676-86-00.9183686.1500048.25798
HardenerPhenolic resinProprietary0.045734.290002.40310
PigmentCarbon black1333-86-40.002030.190000.10643
PolymerEpoxy resin systemProprietary0.092428.670004.85661
subTotal1.06600100.0000056.01624
WireGold alloyGold (Au)7440-57-50.0241399.000001.26779
Palladium (Pd)7440-05-30.000241.000000.01281
subTotal0.02437100.000001.28060
total1.90302100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.