Chemical content 74AXP2T08DP-Q100

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Type number	Package	Package description	Total product weight
74AXP2T08DP-Q100	SOT552-1	TSSOP10	23.31680 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
935334222118	7	1	260		1	235			Singapore, Singapore; Suzhou, China; Bangkok, Thailand

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Adhesive	Filler	Silver (Ag)	7440-22-4	0.72090	80.10000	3.09176
	Polymer	Resin system	Proprietary	0.17910	19.90000	0.76812
		subTotal		0.90000	100.00000	3.85988

Die	Doped silicon	Silicon (Si)	7440-21-3	0.09506	100.00000	0.40771
		subTotal		0.09506	100.00000	0.40771

Lead Frame Material	Copper alloy	Copper (Cu)	7440-50-8	7.89507	97.47000	33.86001
		Iron (Fe)	7439-89-6	0.19440	2.40000	0.83373
		Phosphorus (P)	7723-14-0	0.00243	0.03000	0.01042
		Zinc (Zn)	7440-66-6	0.00810	0.10000	0.03474
		subTotal		8.10000	100.00000	34.73890

Mould Compound	Filler	Misc. Silica compounds (generic)	14808-60-7	11.50500	88.50000	49.34211
	Flame retardant	Non hazardous	Proprietary	0.39000	3.00000	1.67261
	Polymer	Epoxy resin system	Proprietary	1.10500	8.50000	4.73907
		subTotal		13.00000	100.00000	55.75379

Pre-Plating	Pure metal layer	Gold (Au)	7440-57-5	0.01100	1.00000	0.04718
		Nickel (Ni)	7440-02-0	1.06700	97.00000	4.57610
		Palladium (Pd)	7440-05-3	0.02200	2.00000	0.09435
		subTotal		1.10000	100.00000	4.71763

Wire	Pure metal	Gold (Au)	7440-57-5	0.12052	99.00000	0.51687
		Palladium (Pd)	7440-05-3	0.00122	1.00000	0.00522
		subTotal		0.12173	100.00000	0.52209

		total		23.31680	100.00000	100.00000

Note(s):
¹This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.