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Chemical content 74AXP2T3407GT

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Type numberPackagePackage descriptionTotal product weight
74AXP2T3407GTSOT833-1XSON82.47346 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935306977115712601235Suzhou, China; Bangkok, Thailand; Singapore, Singapore; Ayutthaya, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.07130100.000002.88252
subTotal0.07130100.000002.88252
ComponentAdditiveNon hazardousProprietary0.000755.000000.03032
FillerBisphenol A-epichlorohydrin resin25068-38-60.000755.000000.03032
Silica -amorphous-7631-86-90.0075050.000000.30322
PolymerEpoxy resin systemProprietary0.0045030.000000.18193
Phenol Formaldehyde resin (generic)9003-35-40.0015010.000000.06064
subTotal0.01500100.000000.60643
Lead FrameCopper alloyCopper (Cu)7440-50-80.9839493.4419039.78003
Magnesium (Mg)7439-95-40.001530.145700.06203
Nickel (Ni)7440-02-00.030682.914001.24055
Silicon (Si)7440-21-30.006650.631400.26880
Pure metal layerGold (Au)7440-57-50.000370.035000.01490
Nickel (Ni)7440-02-00.028562.712001.15455
Palladium (Pd)7440-05-30.001260.120000.05109
subTotal1.05300100.0000042.57195
Mould CompoundAdditiveNon hazardousProprietary0.005340.410000.21582
FillerSilica -amorphous-7631-86-90.003780.290000.15265
Silica fused60676-86-01.1216786.1500045.34834
HardenerPhenolic resinProprietary0.055864.290002.25821
PigmentCarbon black1333-86-40.002470.190000.10001
PolymerEpoxy resin systemProprietary0.112888.670004.56379
subTotal1.30200100.0000052.63882
WireGold alloyGold (Au)7440-57-50.0318499.000001.28720
Palladium (Pd)7440-05-30.000321.000000.01300
subTotal0.03216100.000001.30020
total2.47346100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.