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Chemical content 74HC21D

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Type numberPackagePackage descriptionTotal product weight
74HC21DSOT108-1SO14123.63237 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9337568706531512601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0779077.900000.06301
PolymerAcrylic resinProprietary0.0152015.200000.01229
Resin systemProprietary0.006906.900000.00558
subTotal0.10000100.000000.08088
DieDoped siliconSilicon (Si)7440-21-30.67010100.000000.54201
subTotal0.67010100.000000.54201
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-843.4131497.4700035.11470
Iron (Fe)7439-89-61.068962.400000.86463
Phosphorus (P)7723-14-00.013360.030000.01081
Zinc (Zn)7440-66-60.044540.100000.03603
subTotal44.54000100.0000036.02617
Mould CompoundAdditiveNon hazardousProprietary3.646734.700002.94966
FillerSilica fused60676-86-061.2961079.0000049.57933
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.655406.000003.76552
PigmentCarbon black1333-86-40.155180.200000.12552
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.103604.000002.51035
Non hazardousProprietary3.181194.100002.57310
Tetramethylbiphenyl diglycidyl ether85954-11-61.551802.000001.25517
subTotal77.59000100.0000062.75865
Pre-PlatingPure metal layerGold (Au)7440-57-50.006701.000000.00542
Nickel (Ni)7440-02-00.6499097.000000.52567
Palladium (Pd)7440-05-30.013402.000000.01084
subTotal0.67000100.000000.54193
WirePure metalCopper (Cu)7440-50-80.06227100.000000.05037
subTotal0.06227100.000000.05037
total123.63237100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.