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Chemical content 74HC32BQ

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Type numberPackagePackage descriptionTotal product weight
74HC32BQSOT762-1DHVQFN1421.80250 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352736881151512601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0945280.100000.43352
PolymerResin systemProprietary0.0234819.900000.10770
subTotal0.11800100.000000.54122
DieDoped siliconSilicon (Si)7440-21-30.18485100.000000.84784
subTotal0.18485100.000000.84784
Lead FrameCopper alloyCopper (Cu)7440-50-88.4266896.1950038.65007
Iron (Fe)7439-89-60.205522.346100.94264
Phosphorus (P)7723-14-00.002650.030200.01213
Zinc (Zn)7440-66-60.008890.101500.04078
Pure metal layerGold (Au)7440-57-50.002650.030200.01213
Nickel (Ni)7440-02-00.106921.220500.49038
Palladium (Pd)7440-05-30.004910.056000.02250
Silver (Ag)7440-22-40.001800.020500.00824
subTotal8.76000100.0000040.17887
Mould CompoundAdditiveNon hazardousProprietary0.369162.910001.69321
FillerSilica -amorphous-7631-86-90.442743.490002.03069
Silica fused60676-86-010.7602784.8200049.35335
PigmentCarbon black1333-86-40.020300.160000.09310
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.137011.080000.62841
Epoxy resin systemProprietary0.201711.590000.92516
Phenolic resinProprietary0.285442.250001.30918
Tetramethylbiphenyl diglycidyl ether85954-11-60.469383.700002.15288
subTotal12.68600100.0000058.18598
WirePure metalCopper (Cu)7440-50-80.0518096.550000.23760
Pure metal layerGold (Au)7440-57-50.000190.350000.00086
Palladium (Pd)7440-05-30.001663.100000.00763
subTotal0.05365100.000000.24609
total21.80250100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.