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Chemical content 74HC541D

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Type numberPackagePackage descriptionTotal product weight
74HC541DSOT163-1SO20511.67645 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9337155006531012601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-410.4130080.100002.03508
PolymerResin systemProprietary2.5870019.900000.50559
subTotal13.00000100.000002.54067
DieDoped siliconSilicon (Si)7440-21-30.30262100.000000.05914
subTotal0.30262100.000000.05914
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-8151.0785097.4700029.52618
Iron (Fe)7439-89-63.720002.400000.72702
Phosphorus (P)7723-14-00.046500.030000.00909
Zinc (Zn)7440-66-60.155000.100000.03029
subTotal155.00000100.0000030.29258
Mould CompoundFillerSilica -amorphous-7631-86-92.040000.600000.39869
Silica fused60676-86-0266.3220078.3300052.04891
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-820.740006.100004.05334
PigmentCarbon black1333-86-40.680000.200000.13290
PolymerEpoxy resin systemProprietary30.130808.862005.88864
Phenolic resinProprietary20.087205.908003.92576
subTotal340.00000100.0000066.44824
Pre-PlatingPure metal layerGold (Au)7440-57-50.032001.000000.00625
Nickel (Ni)7440-02-03.1040097.000000.60663
Palladium (Pd)7440-05-30.064002.000000.01251
subTotal3.20000100.000000.62539
WirePure metalCopper (Cu)7440-50-80.17383100.000000.03397
subTotal0.17383100.000000.03397
total511.67645100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.