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Chemical content 74LV04PW

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Type numberPackagePackage descriptionTotal product weight
74LV04PWSOT402-1TSSOP1452.25071 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9351742101181512601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0311677.900000.05964
PolymerAcrylic resinProprietary0.0060815.200000.01164
Resin systemProprietary0.002766.900000.00528
subTotal0.04000100.000000.07656
DieDoped siliconSilicon (Si)7440-21-30.62635100.000001.19875
subTotal0.62635100.000001.19875
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.0456497.4700036.45049
Iron (Fe)7439-89-60.468962.400000.89752
Phosphorus (P)7723-14-00.005860.030000.01122
Zinc (Zn)7440-66-60.019540.100000.03740
subTotal19.54000100.0000037.39663
Mould CompoundFillerSilica -amorphous-7631-86-90.190080.600000.36378
Silica fused60676-86-024.8149478.3300047.49207
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.932486.100003.69848
PigmentCarbon black1333-86-40.063360.200000.12126
PolymerEpoxy resin systemProprietary2.807488.862005.37310
Phenolic resinProprietary1.871655.908003.58207
subTotal31.68000100.0000060.63076
Pre-PlatingPure metal layerGold (Au)7440-57-50.002901.000000.00555
Nickel (Ni)7440-02-00.2813097.000000.53837
Palladium (Pd)7440-05-30.005802.000000.01110
subTotal0.29000100.000000.55502
WirePure metalCopper (Cu)7440-50-80.07436100.000000.14231
subTotal0.07436100.000000.14231
total52.25071100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.