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Chemical content 74LVC125APW

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Type numberPackagePackage descriptionTotal product weight
74LVC125APWSOT402-1TSSOP1451.80421 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352317201182712601235Nijmegen, Netherlands; Hsin-chu, Taiwan; Suzhou, China; Bangkok, Thailand; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0311677.900000.06015
PolymerAcrylic resinProprietary0.0060815.200000.01174
Resin systemProprietary0.002766.900000.00533
subTotal0.04000100.000000.07722
DieDoped siliconSilicon (Si)7440-21-30.18006100.000000.34758
subTotal0.18006100.000000.34758
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.0456497.4700036.76465
Iron (Fe)7439-89-60.468962.400000.90525
Phosphorus (P)7723-14-00.005860.030000.01132
Zinc (Zn)7440-66-60.019540.100000.03772
subTotal19.54000100.0000037.71894
Mould CompoundFillerSilica -amorphous-7631-86-90.190080.600000.36692
Silica fused60676-86-024.8149478.3300047.90140
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.932486.100003.73035
PigmentCarbon black1333-86-40.063360.200000.12231
PolymerEpoxy resin systemProprietary2.807488.862005.41941
Phenolic resinProprietary1.871655.908003.61294
subTotal31.68000100.0000061.15333
Pre-PlatingPure metal layerGold (Au)7440-57-50.002901.000000.00560
Nickel (Ni)7440-02-00.2813097.000000.54301
Palladium (Pd)7440-05-30.005802.000000.01120
subTotal0.29000100.000000.55981
WirePure metalCopper (Cu)7440-50-80.07415100.000000.14313
subTotal0.07415100.000000.14313
total51.80421100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.