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Chemical content 74LVC157AD

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Type numberPackagePackage descriptionTotal product weight
74LVC157ADSOT109-1SO16137.35260 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352608981181412601235Suzhou, China; Shanghai, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1311577.900000.09549
PolymerAcrylic resinProprietary0.0255915.200000.01863
Resin systemProprietary0.011626.900000.00846
subTotal0.16836100.000000.12258
DieDoped siliconSilicon (Si)7440-21-30.19913100.000000.14498
subTotal0.19913100.000000.14498
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-848.6504297.4700035.42009
Iron (Fe)7439-89-61.197922.400000.87215
Phosphorus (P)7723-14-00.014970.030000.01090
Zinc (Zn)7440-66-60.049910.100000.03634
subTotal49.91322100.0000036.33948
Mould CompoundFillerSilica -amorphous-7631-86-90.513970.600000.37420
Silica fused60676-86-067.0991478.3300048.85174
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-85.225396.100003.80436
PigmentCarbon black1333-86-40.171320.200000.12473
PolymerEpoxy resin systemProprietary7.591388.862005.52693
Phenolic resinProprietary5.060925.908003.68462
subTotal85.66212100.0000062.36658
Pre-PlatingPure metal layerGold (Au)7440-57-50.012791.000000.00931
Nickel (Ni)7440-02-01.2408897.000000.90343
Palladium (Pd)7440-05-30.025592.000000.01863
subTotal1.27926100.000000.93137
WirePure metalCopper (Cu)7440-50-80.13051100.000000.09502
subTotal0.13051100.000000.09502
total137.35260100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.