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Chemical content 74LVC4245ABQ

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Type numberPackagePackage descriptionTotal product weight
74LVC4245ABQSOT815-1DHVQFN2450.27801 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93528561911812126030 s123520 s3Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001271.000000.00253
FillerSilver (Ag)7440-22-40.0953975.000000.18973
PolymerAcrylic resinProprietary0.007636.000000.01518
Resin systemProprietary0.0228918.000000.04554
subTotal0.12719100.000000.25298
DieDoped siliconSilicon (Si)7440-21-30.44163100.000000.87837
subTotal0.44163100.000000.87837
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.0783297.4700037.94565
Iron (Fe)7439-89-60.469762.400000.93433
Phosphorus (P)7723-14-00.005870.030000.01168
Zinc (Zn)7440-66-60.019570.100000.03893
subTotal19.57353100.0000038.93059
Mould CompoundAdditiveNon hazardousProprietary0.880352.984001.75097
FillerSilica -amorphous-7631-86-91.029633.490002.04788
Silica fused60676-86-025.0239484.8200049.77115
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.295611.002000.58796
PigmentCarbon black1333-86-40.048380.164000.09623
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-71.091883.701002.17169
Epoxy resin systemProprietary0.467911.586000.93064
Phenolic resinProprietary0.664692.253001.32203
subTotal29.50241100.0000058.67855
Pre-PlatingPure metal layerGold (Au)7440-57-50.004971.000000.00988
Nickel (Ni)7440-02-00.4521491.000000.89928
Palladium (Pd)7440-05-30.039758.000000.07906
subTotal0.49686100.000000.98822
WirePure metalCopper (Cu)7440-50-80.1316996.550000.26193
Pure metal layerGold (Au)7440-57-50.000480.350000.00095
Palladium (Pd)7440-05-30.004233.100000.00841
subTotal0.13640100.000000.27129
total50.27801100.00000100.00000
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