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Chemical content 74LVC594ABQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC594ABQ-Q100SOT763-1DHVQFN1621.63861 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9353022341154126030 s123520 s3Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001001.000000.00461
FillerSilver (Ag)7440-22-40.0747675.000000.34549
PolymerAcrylic resinProprietary0.005986.000000.02764
Resin systemProprietary0.0179418.000000.08292
subTotal0.09968100.000000.46066
DieDoped siliconSilicon (Si)7440-21-30.31208100.000001.44224
subTotal0.31208100.000001.44224
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.9746797.4700036.85391
Iron (Fe)7439-89-60.196362.400000.90745
Phosphorus (P)7723-14-00.002450.030000.01134
Zinc (Zn)7440-66-60.008180.100000.03781
subTotal8.18167100.0000037.81051
Mould CompoundAdditiveNon hazardousProprietary0.371162.984001.71529
FillerSilica -amorphous-7631-86-90.434103.490002.00615
Silica fused60676-86-010.5503184.8200048.75688
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.124631.002000.57598
PigmentCarbon black1333-86-40.020400.164000.09427
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.460353.701002.12744
Epoxy resin systemProprietary0.197271.586000.91168
Phenolic resinProprietary0.280242.253001.29509
subTotal12.43847100.0000057.48278
Pre-PlatingPure metal layerGold (Au)7440-57-50.016373.000000.07563
Nickel (Ni)7440-02-00.5035192.300002.32689
Palladium (Pd)7440-05-30.016913.100000.07815
Silver (Ag)7440-22-40.008731.600000.04034
subTotal0.54551100.000002.52101
WirePure metalCopper (Cu)7440-50-80.0590996.550000.27308
Pure metal layerGold (Au)7440-57-50.000210.350000.00099
Palladium (Pd)7440-05-30.001903.100000.00877
subTotal0.06120100.000000.28284
total21.63861100.00000100.00000
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