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Chemical content 74LVCH8T245PW

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Type numberPackagePackage descriptionTotal product weight
74LVCH8T245PWSOT355-1TSSOP2487.60434 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352901511181312601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1648177.900000.18813
PolymerAcrylic resinProprietary0.0321615.200000.03671
Resin systemProprietary0.014606.900000.01666
subTotal0.21157100.000000.24150
DieDoped siliconSilicon (Si)7440-21-30.95361100.000001.08855
subTotal0.95361100.000001.08855
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-834.7610397.4700039.67957
Iron (Fe)7439-89-60.855922.400000.97703
Phosphorus (P)7723-14-00.010700.030000.01221
Zinc (Zn)7440-66-60.035660.100000.04071
subTotal35.66331100.0000040.70952
Mould CompoundFillerSilica -amorphous-7631-86-90.295460.600000.33727
Silica fused60676-86-038.5722878.3300044.03010
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-83.003846.100003.42887
PigmentCarbon black1333-86-40.098490.200000.11242
PolymerEpoxy resin systemProprietary4.363948.862004.98142
Phenolic resinProprietary2.909295.908003.32095
subTotal49.24330100.0000056.21103
Pre-PlatingPure metal layerGold (Au)7440-57-50.041453.000000.04732
Nickel (Ni)7440-02-01.2754292.300001.45589
Palladium (Pd)7440-05-30.042843.100000.04890
Silver (Ag)7440-22-40.022111.600000.02524
subTotal1.38182100.000001.57735
WirePure metalCopper (Cu)7440-50-80.15072100.000000.17205
subTotal0.15072100.000000.17205
total87.60434100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.