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Chemical content HEF40106BTT

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Type numberPackagePackage descriptionTotal product weight
HEF40106BTTSOT402-1TSSOP1451.86881 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352702761181712601235Jiangyin, China; Nijmegen, Netherlands; Shanghai, China; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0311677.900000.06007
PolymerAcrylic resinProprietary0.0060815.200000.01172
Resin systemProprietary0.002766.900000.00532
subTotal0.04000100.000000.07711
DieDoped siliconSilicon (Si)7440-21-30.23087100.000000.44510
subTotal0.23087100.000000.44510
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.0456497.4700036.71886
Iron (Fe)7439-89-60.468962.400000.90413
Phosphorus (P)7723-14-00.005860.030000.01130
Zinc (Zn)7440-66-60.019540.100000.03767
subTotal19.54000100.0000037.67196
Mould CompoundFillerSilica -amorphous-7631-86-90.190080.600000.36646
Silica fused60676-86-024.8149478.3300047.84175
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.932486.100003.72571
PigmentCarbon black1333-86-40.063360.200000.12215
PolymerEpoxy resin systemProprietary2.807488.862005.41266
Phenolic resinProprietary1.871655.908003.60844
subTotal31.68000100.0000061.07717
Pre-PlatingPure metal layerGold (Au)7440-57-50.002901.000000.00559
Nickel (Ni)7440-02-00.2813097.000000.54233
Palladium (Pd)7440-05-30.005802.000000.01118
subTotal0.29000100.000000.55910
WirePure metalCopper (Cu)7440-50-80.08794100.000000.16955
subTotal0.08794100.000000.16955
total51.86881100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.