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Chemical content HEF4040BT

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Type numberPackagePackage descriptionTotal product weight
HEF4040BTSOT109-1SO16143.54325 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9333728506531312601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0233777.900000.01628
PolymerAcrylic resinProprietary0.0045615.200000.00318
Resin systemProprietary0.002076.900000.00144
subTotal0.03000100.000000.02090
DieDoped siliconSilicon (Si)7440-21-30.90084100.000000.62758
subTotal0.90084100.000000.62758
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-836.7218297.4700025.58241
Iron (Fe)7439-89-60.904202.400000.62991
Phosphorus (P)7723-14-00.011300.030000.00787
Zinc (Zn)7440-66-60.037680.100000.02625
subTotal37.67500100.0000026.24644
Mould CompoundFillerSilica -amorphous-7631-86-90.625620.600000.43584
Silica fused60676-86-081.6746978.3300056.89901
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-86.360476.100004.43105
PigmentCarbon black1333-86-40.208540.200000.14528
PolymerEpoxy resin systemProprietary9.240418.862006.43737
Phenolic resinProprietary6.160275.908004.29158
subTotal104.27000100.0000072.64013
Pre-PlatingPure metal layerGold (Au)7440-57-50.005651.000000.00394
Nickel (Ni)7440-02-00.5480597.000000.38180
Palladium (Pd)7440-05-30.011302.000000.00787
subTotal0.56500100.000000.39361
WirePure metalCopper (Cu)7440-50-80.10240100.000000.07134
subTotal0.10240100.000000.07134
total143.54325100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.