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Chemical content NXB0104PW

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Type numberPackagePackage descriptionTotal product weight
NXB0104PWSOT402-1TSSOP1459.94317 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935690855118312601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0155877.900000.02599
PolymerAcrylic resinProprietary0.0030415.200000.00507
Resin systemProprietary0.001386.900000.00230
subTotal0.02000100.000000.03336
DieDoped siliconSilicon (Si)7440-21-30.50476100.000000.84206
subTotal0.50476100.000000.84206
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-818.7809297.4700031.33121
Iron (Fe)7439-89-60.462442.400000.77147
Phosphorus (P)7723-14-00.005780.030000.00964
Zinc (Zn)7440-66-60.019270.100000.03214
subTotal19.26841100.0000032.14446
Mould CompoundFillerSilica -amorphous-7631-86-90.237600.600000.39638
Silica fused60676-86-031.0186878.3300051.74681
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.415606.100004.02982
PigmentCarbon black1333-86-40.079200.200000.13213
PolymerEpoxy resin systemProprietary3.509358.862005.85447
Phenolic resinProprietary2.339575.908003.90298
subTotal39.60000100.0000066.06259
Pre-PlatingPure metal layerGold (Au)7440-57-50.014673.000000.02448
Nickel (Ni)7440-02-00.4514692.300000.75314
Palladium (Pd)7440-05-30.015163.100000.02530
Silver (Ag)7440-22-40.007831.600000.01306
subTotal0.48912100.000000.81598
WirePure metalCopper (Cu)7440-50-80.06088100.000000.10157
subTotal0.06088100.000000.10157
total59.94317100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.