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Chemical content PMEG120G20ELP-Q

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Type numberPackagePackage descriptionTotal product weight
PMEG120G20ELP-QSOD128FlatPower32.42700 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662757115312601235Seremban, Malaysia; D-22529 HAMBURG, Germany; Cardiff, Great BritainLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.33000100.000001.01767
subTotal0.33000100.000001.01767
ClipCopper alloyCopper (Cu)7440-50-85.2097099.8600016.06592
Iron (Fe)7439-89-60.005220.100000.01609
Phosphorus (P)7723-14-00.002090.040000.00644
subTotal5.21700100.0000016.08845
Lead FrameCopper alloyCopper (Cu)7440-50-811.6332498.4200035.87518
Iron (Fe)7439-89-60.011820.100000.03645
Phosphorus (P)7723-14-00.003550.030000.01094
Pure metal layerSilver (Ag)7440-22-40.171391.450000.52854
subTotal11.82000100.0000036.45111
Mould CompoundFillerSilica -amorphous-7631-86-91.2210010.000003.76538
Silica fused60676-86-09.1575075.0000028.24036
PigmentCarbon black1333-86-40.036630.300000.11296
PolymerEpoxy resin systemProprietary0.940177.700002.89934
Phenolic resinProprietary0.854707.000002.63577
subTotal12.21000100.0000037.65381
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00003
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000020.005000.00005
Tin solderTin (Sn)7440-31-50.3499699.990001.07924
subTotal0.35000100.000001.07934
Solder PasteLead alloyLead (Pb)7439-92-12.3125092.500007.13140
Silver alloySilver (Ag)7440-22-40.062502.500000.19274
Tin alloyTin (Sn)7440-31-50.125005.000000.38548
subTotal2.50000100.000007.70962
total32.42700100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.