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Chemical content PSMN041-100MSE

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Type numberPackagePackage descriptionTotal product weight
PSMN041-100MSESOT1210mLFPAK26.03000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934663732115212601235Manchester, United Kingdom; Cabuyao, Philippines; Sherman, United States Of America; Cardiff, Great BritainLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.90000100.000003.45755
subTotal0.90000100.000003.45755
ClipCopper alloyCopper (Cu)7440-50-85.6886099.8000021.85401
Iron (Fe)7439-89-60.008550.150000.03285
Phosphorus (P)7723-14-00.002850.050000.01095
subTotal5.70000100.0000021.89781
Lead FrameCopper alloyCopper (Cu)7440-50-813.8722099.8000053.29312
Iron (Fe)7439-89-60.020850.150000.08010
Phosphorus (P)7723-14-00.006950.050000.02670
subTotal13.90000100.0000053.39992
Mould CompoundFillerSilica fused60676-86-00.8250082.500003.16942
HardenerPhenol/polymer with 4.4'-bis(methoxymethyl)1.1'-bisphenyl205830-20-20.081008.100000.31118
PigmentCarbon black1333-86-40.005000.500000.01921
PolymerFormaldehyde, polymer with 2-methoxynaphthalene and 2-methylphenol, glycidyl ether944410-31-50.089008.900000.34191
subTotal1.00000100.000003.84172
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00148
Tin alloyTin (Sn)7440-31-53.8496299.9900014.78915
subTotal3.85000100.0000014.79063
Solder PasteLead alloyLead (Pb)7439-92-10.4995092.500001.91894
Silver (Ag)7440-22-40.013502.500000.05186
Tin (Sn)7440-31-50.027005.000000.10373
subTotal0.54000100.000002.07453
Solder PasteImpurityAntimony (Sb)7440-36-00.000040.030000.00016
Lead alloyLead (Pb)7439-92-10.1294692.470000.49734
Silver alloySilver (Ag)7440-22-40.003502.500000.01345
Tin alloyTin (Sn)7440-31-50.007005.000000.02689
subTotal0.14000100.000000.53784
total26.03000100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.