×

Chemical content PSMN072-100MSE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PSMN072-100MSESOT1210mLFPAK25.51000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934663733115212601235Cabuyao, Philippines; Sherman, United States Of America; Cardiff, Great Britain; Manchester, United KingdomLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.62000100.000002.43042
subTotal0.62000100.000002.43042
ClipCopper alloyCopper (Cu)7440-50-85.6886099.8000022.29949
Iron (Fe)7439-89-60.008550.150000.03352
Phosphorus (P)7723-14-00.002850.050000.01117
subTotal5.70000100.0000022.34418
Lead FrameCopper alloyCopper (Cu)7440-50-813.8722099.8000054.37946
Iron (Fe)7439-89-60.020850.150000.08173
Phosphorus (P)7723-14-00.006950.050000.02724
subTotal13.90000100.0000054.48843
Mould CompoundFillerSilica fused60676-86-00.8250082.500003.23403
HardenerPhenol/polymer with 4.4'-bis(methoxymethyl)1.1'-bisphenyl205830-20-20.081008.100000.31752
PigmentCarbon black1333-86-40.005000.500000.01960
PolymerFormaldehyde, polymer with 2-methoxynaphthalene and 2-methylphenol, glycidyl ether944410-31-50.089008.900000.34888
subTotal1.00000100.000003.92003
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00151
Tin alloyTin (Sn)7440-31-53.8496299.9900015.09061
subTotal3.85000100.0000015.09212
Solder PasteLead alloyLead (Pb)7439-92-10.3330092.500001.30537
Silver (Ag)7440-22-40.009002.500000.03528
Tin (Sn)7440-31-50.018005.000000.07056
subTotal0.36000100.000001.41121
Solder PasteImpurityAntimony (Sb)7440-36-00.000020.030000.00009
Lead alloyLead (Pb)7439-92-10.0739892.470000.28999
Silver alloySilver (Ag)7440-22-40.002002.500000.00784
Tin alloyTin (Sn)7440-31-50.004005.000000.01568
subTotal0.08000100.000000.31360
total25.51000100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.