Package information
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| SOT8023-1 | WLCSP8 | wafer level chip-scale package, 8 bumps; 0.75 x 1.55 x 0.60 mm | 2020-08-12 |
Boards
| Part number | Description | Type | Quick links | Shop link |
|---|---|---|---|---|
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Description NEVB-LOGIC03 is a dual in-line logic footprint adapter board, designed to simplify the evaluation of Nexperia logic devices by offering several package footprints.
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Type Evaluation board
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Quick links
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Shop link
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Related documents
| File name | Title | Type | Date |
|---|---|---|---|
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT8023-1 | 3D model for products with SOT8023-1 package | Design support | 2023-02-07 |
| SOT8023-1 | wafer level chip-scale package, 8 bumps; 0.75 x 1.55 x 0.60 mm | Package information | 2022-04-20 |
| SOT8023-1_336 | WLCSP8; Reel dry pack for SMD, 7"; Q1/T1 product orientation | Packing information | 2023-03-03 |