Package information
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| SOT8057-1 | WLCSP9 | wafer level chip-scale pakage; 9 bumps; 0.92 × 0.92 × 0.42 mm body | 2023-06-01 |
Boards
| Part number | Description | Type | Quick links | Shop link |
|---|---|---|---|---|
|
Description NEVB-LOGIC03 is a dual in-line logic footprint adapter board, designed to simplify the evaluation of Nexperia logic devices by offering several package footprints.
|
Type Evaluation board
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Quick links
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Shop link
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Related documents
| File name | Title | Type | Date |
|---|---|---|---|
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT8057-1 | wafer level chip-scale pakage; 9 bumps; 0.92 × 0.92 × 0.42 mm body | Package information | 2023-06-13 |
| SOT8057-1_336 | WLCSP9; Reel dry pack for SMD, 7"; Q1/T1 product orientation | Packing information | 2023-08-10 |
Products in this package
Analog & Logic ICs
| Type number | Description | Quick access |
|---|---|---|
| NXT4556AUR | SIM card interface level translator |