74HC238-Q100; 74HCT238-Q100
3-to-8 line decoder/demultiplexer
The 74HC238-Q100; 74HCT238-Q100 decodes three binary weighted address inputs (A0, A1 and A2) to eight mutually exclusive outputs (Y0 to Y7). The device features three enable inputs (E1 and E2 and E3). Every output will be LOW unless E1 and E2 are LOW and E3 is HIGH. This multiple enable function allows easy parallel expansion to a 1-of-32 (5 to 32 lines) decoder with just four '238 ICs and one inverter. The '238 can be used as an eight output demultiplexer by using one of the active LOW enable inputs as the data input and the remaining enable inputs as strobes. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Demultiplexing capability
Multiple input enable for easy expansion
Ideal for memory chip select decoding
Active HIGH mutually exclusive outputs
Multiple package options
Complies with JEDEC standard no. 7A
Input levels:
For 74HC238: CMOS level
For 74HCT238: TTL level
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints
Parametrics
| Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|
| 74HC238BQ-Q100 | 2.0 - 6.0 | CMOS | ± 5.2 | 14 | low | -40~125 | DHVQFN16 |
| 74HC238D-Q100 | 2.0 - 6.0 | CMOS | ± 5.2 | 14 | low | -40~125 | SO16 |
| 74HC238PW-Q100 | 2.0 - 6.0 | CMOS | ± 5.2 | 14 | low | -40~125 | TSSOP16 |
| 74HCT238BQ-Q100 | 4.5 - 5.5 | TTL | ± 4 | 18 | low | -40~125 | DHVQFN16 |
| 74HCT238D-Q100 | 4.5 - 5.5 | TTL | ± 4 | 18 | low | -40~125 | SO16 |
| 74HCT238PW-Q100 | 4.5 - 5.5 | TTL | ± 4 | 18 | low | -40~125 | TSSOP16 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74HC238BQ-Q100 | 74HC238BQ-Q100X (935300333115) |
Active | HC238 |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
| 74HC238D-Q100 | 74HC238D-Q100J (935300044118) |
Active | 74HC238D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
| 74HC238PW-Q100 | 74HC238PW-Q100J (935300045118) |
Active | HC238 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
| 74HCT238BQ-Q100 | 74HCT238BQ-Q100X (935300334115) |
Active | HCT238 |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
| 74HCT238D-Q100 | 74HCT238D-Q100J (935300068118) |
Active | 74HCT238D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
| 74HCT238PW-Q100 | 74HCT238PW-Q100J (935300069118) |
Active | HCT238 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74HC238BQ-Q100 | 74HC238BQ-Q100X | 74HC238BQ-Q100 |
|
|
| 74HC238D-Q100 | 74HC238D-Q100J | 74HC238D-Q100 |
|
|
| 74HC238PW-Q100 | 74HC238PW-Q100J | 74HC238PW-Q100 |
|
|
| 74HCT238BQ-Q100 | 74HCT238BQ-Q100X | 74HCT238BQ-Q100 |
|
|
| 74HCT238D-Q100 | 74HCT238D-Q100J | 74HCT238D-Q100 |
|
|
| 74HCT238PW-Q100 | 74HCT238PW-Q100J | 74HCT238PW-Q100 |
|
|
Documentation (17)
| File name | Title | Type | Date |
|---|---|---|---|
| 74HC_HCT238_Q100 | 3-to-8 line decoder/demultiplexer | Data sheet | 2024-03-21 |
| AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN16_SOT763-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SO16_SOT109-1_mk | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | Marcom graphics | 2017-01-28 |
| TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
| SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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