Chemical content 74HCT238BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT238BQ-Q100SOT763-1DHVQFN1621.56538 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300334115512601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001001.000000.00462
FillerSilver (Ag)7440-22-40.0747675.000000.34667
PolymerAcrylic resinProprietary0.005986.000000.02773
Resin systemProprietary0.0179418.000000.08320
DieDoped siliconSilicon (Si)7440-21-30.23745100.000001.10107
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.9746797.4700036.97906
Iron (Fe)7439-89-60.196362.400000.91053
Phosphorus (P)7723-14-00.002450.030000.01138
Zinc (Zn)7440-66-60.008180.100000.03794
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.67843
FillerSilica -amorphous-7631-86-90.434103.490002.01296
Silica fused60676-86-010.5503184.8200048.92244
PigmentCarbon black1333-86-40.019900.160000.09228
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.62292
Epoxy resin systemProprietary0.197771.590000.91708
Phenolic resinProprietary0.279872.250001.29775
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.13408
Pre-PlatingPure metal layerGold (Au)7440-57-50.016373.000000.07589
Nickel (Ni)7440-02-00.5035192.300002.33479
Palladium (Pd)7440-05-30.016913.100000.07842
Silver (Ag)7440-22-40.008731.600000.04047
WirePure metalCopper (Cu)7440-50-80.0604496.550000.28028
Pure metal layerGold (Au)7440-57-50.000220.350000.00102
Palladium (Pd)7440-05-30.001943.100000.00900
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.