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Chemical content 74AXP1T34GN

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Type numberPackagePackage descriptionTotal product weight
74AXP1T34GNSOT1115X2SON60.87380 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935306992125812601235Seremban, Malaysia; Singapore, Singapore; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.03565100.000004.07977
subTotal0.03565100.000004.07977
ComponentAdditiveNon hazardousProprietary0.000255.000000.02861
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02861
Silica -amorphous-7631-86-90.0025050.000000.28611
PolymerEpoxy resin systemProprietary0.0015030.000000.17166
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05722
subTotal0.00500100.000000.57221
Lead FrameCopper alloyCopper (Cu)7440-50-80.3638694.5100041.64151
Magnesium (Mg)7439-95-40.000580.150000.06609
Nickel (Ni)7440-02-00.011362.950001.29978
Silicon (Si)7440-21-30.002460.640000.28199
Pure metal layerGold (Au)7440-57-50.000080.020000.00881
Nickel (Ni)7440-02-00.006311.640000.72259
Palladium (Pd)7440-05-30.000350.090000.03965
subTotal0.38500100.0000044.06042
Mould CompoundAdditiveNon hazardousProprietary0.001780.410000.20411
FillerSilica -amorphous-7631-86-90.001260.290000.14437
Silica fused60676-86-00.3747586.1500042.88767
HardenerPhenolic resinProprietary0.018664.290002.13567
PigmentCarbon black1333-86-40.000830.190000.09459
PolymerEpoxy resin systemProprietary0.037718.670004.31615
subTotal0.43500100.0000049.78256
WireGold alloyGold (Au)7440-57-50.0130299.000001.48987
Palladium (Pd)7440-05-30.000131.000000.01505
subTotal0.01315100.000001.50492
total0.87380100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.