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Chemical content 74HC132DB

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Type numberPackagePackage descriptionTotal product weight
74HC132DBSOT337-1SSOP14103.60479 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9351714401181612601235Nijmegen, Netherlands; Suzhou, China; Bangkok, ThailandLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-46.0000075.000005.79124
PolymerResin systemProprietary2.0000025.000001.93041
subTotal8.00000100.000007.72165
DieDoped siliconSilicon (Si)7440-21-30.27707100.000000.26743
subTotal0.27707100.000000.26743
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-828.2663097.4700027.28281
Iron (Fe)7439-89-60.696002.400000.67178
Phosphorus (P)7723-14-00.008700.030000.00840
Zinc (Zn)7440-66-60.029000.100000.02799
subTotal29.00000100.0000027.99098
Mould CompoundFillerMisc. Silica compounds (generic)14808-60-749.5000075.0000047.77771
Flame retardantAntimony Trioxide (Sb2O3)1309-64-41.452002.200001.40148
Misc. Bromine compounds (generic)Proprietary1.056001.600001.01926
PolymerEpoxy resin systemProprietary13.9920021.2000013.50517
subTotal66.00000100.0000063.70362
Pre-PlatingPure metal layerGold (Au)7440-57-50.001801.000000.00174
Nickel (Ni)7440-02-00.1746097.000000.16853
Palladium (Pd)7440-05-30.003602.000000.00347
subTotal0.18000100.000000.17374
WirePure metalGold (Au)7440-57-50.1462499.000000.14115
Palladium (Pd)7440-05-30.001481.000000.00143
subTotal0.14771100.000000.14258
total103.60479100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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