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Chemical content 74LV14PW

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Type numberPackagePackage descriptionTotal product weight
74LV14PWSOT402-1TSSOP1452.16045 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9351752301181412601235Bangkok, Thailand; Nijmegen, Netherlands; Shanghai, China; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0311677.900000.05974
PolymerAcrylic resinProprietary0.0060815.200000.01166
Resin systemProprietary0.002766.900000.00529
subTotal0.04000100.000000.07669
DieDoped siliconSilicon (Si)7440-21-30.53212100.000001.02015
subTotal0.53212100.000001.02015
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.0456497.4700036.51356
Iron (Fe)7439-89-60.468962.400000.89907
Phosphorus (P)7723-14-00.005860.030000.01124
Zinc (Zn)7440-66-60.019540.100000.03746
subTotal19.54000100.0000037.46133
Mould CompoundFillerSilica -amorphous-7631-86-90.190080.600000.36441
Silica fused60676-86-024.8149478.3300047.57425
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.932486.100003.70488
PigmentCarbon black1333-86-40.063360.200000.12147
PolymerEpoxy resin systemProprietary2.807488.862005.38240
Phenolic resinProprietary1.871655.908003.58826
subTotal31.68000100.0000060.73567
Pre-PlatingPure metal layerGold (Au)7440-57-50.002901.000000.00556
Nickel (Ni)7440-02-00.2813097.000000.53930
Palladium (Pd)7440-05-30.005802.000000.01112
subTotal0.29000100.000000.55598
WirePure metalCopper (Cu)7440-50-80.07833100.000000.15017
subTotal0.07833100.000000.15017
total52.16045100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.