Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

74AUP1T34

Low-power dual supply translating buffer

The 74AUP1T34 is a single dual supply translating buffer. Input A is referenced to VCC(A) and output Y is referenced to VCC(Y). Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times. This device ensures very low static and dynamic power consumption across the entire VCC range from 1.1 V to 3.6 V. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

Features and benefits

  • Wide supply voltage range from 1.1 V to 3.6 V

  • CMOS low power dissipation

  • High noise immunity

  • Complies with JEDEC standards:

    • JESD8-7 (1.2 V to 1.95 V)

    • JESD8-5 (1.8 V to 2.7 V)

    • JESD8-B (2.7 V to 3.6 V)

  • Wide supply voltage range:

    • VCC(A): 1.1 V to 3.6 V

    • VCC(Y): 1.1 V to 3.6 V

  • Low static power consumption; ICC = 0.9 µA (maximum)

  • Each port operates over the full 1.1 V to 3.6 V power supply range

  • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B

  • Overvoltage tolerant inputs to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • IOFF circuitry provides partial Power-down mode operation

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

Parametrics

Type number VCC (V) Logic switching levels Output drive capability (mA) Nr of bits Power dissipation considerations Tamb (°C) Rth(j-a) (K/W) Ψth(j-top) (K/W) Rth(j-c) (K/W) Package name
74AUP1T34GM n.a. CMOS ± 4 1 ultra low -40~125 323 8.4 164 XSON6
74AUP1T34GM-Q100 n.a. CMOS ± 4 70 1 ultra low -40~125 323 8.4 164 XSON6
74AUP1T34GN n.a. CMOS ± 4 1 ultra low -40~125 367 28.9 227 XSON6
74AUP1T34GS n.a. CMOS ± 4 1 ultra low -40~125 349 36.7 236 XSON6
74AUP1T34GW n.a. CMOS ± 4 1 ultra low -40~125 292 65.6 165 TSSOP5
74AUP1T34GW-Q100 n.a. CMOS ± 4 1 ultra low -40~125 292 65.6 165 TSSOP5
74AUP1T34GX n.a. CMOS ± 4 1 ultra low -40~125 286 60.6 160 X2SON5
74AUP1T34GZ n.a. CMOS ± 4 1 ultra low -40~125 319 34.7 201.7 XSON5
74AUP1T34GZ-Q100 n.a. CMOS ultra low -40~125 319 34.7 201.7 XSON5

Package

Type number Orderable part number, (Ordering code (12NC)) Status Marking Package Package information Reflow-/Wave soldering Packing
74AUP1T34GM 74AUP1T34GM,115
(935280517115)
Active pQ SOT886
XSON6
(SOT886)
SOT886 SOT886_115
74AUP1T34GM,132
(935280517132)
Active pQ SOT886_132
74AUP1T34GM-Q100 74AUP1T34GM‑Q100X
(935690766115)
Active pQ SOT886
XSON6
(SOT886)
SOT886 SOT886_115
74AUP1T34GN 74AUP1T34GN,132
(935291752132)
Active pQ SOT1115
XSON6
(SOT1115)
SOT1115 SOT1115_132
74AUP1T34GS 74AUP1T34GS,132
(935292876132)
Active pQ SOT1202
XSON6
(SOT1202)
SOT1202 SOT1202_132
74AUP1T34GW 74AUP1T34GW,125
(935280516125)
Active pQ SOT353-1
TSSOP5
(SOT353-1)
SOT353-1 WAVE_BG-BD-1
SOT353-1_125
74AUP1T34GW-Q100 74AUP1T34GW‑Q100H
(935302098125)
Active pQ SOT353-1
TSSOP5
(SOT353-1)
SOT353-1 WAVE_BG-BD-1
SOT353-1_125
74AUP1T34GX 74AUP1T34GXH
(935302887125)
Active pQ SOT1226-3
X2SON5
(SOT1226-3)
SOT1226-3 SOT1226-3_125
74AUP1T34GZ 74AUP1T34GZYL
(935691652315)
Active pQ SOT8065-1
XSON5
(SOT8065-1)
SOT8065-1 SOT8065-1_315
74AUP1T34GZ-Q100 74AUP1T34GZ‑Q100YL
(935691699315)
Active pQ SOT8065-1
XSON5
(SOT8065-1)
SOT8065-1 SOT8065-1_315

All type numbers in the table below are discontinued.

Type number Orderable part number, (Ordering code (12NC)) Status Marking Package Package information Reflow-/Wave soldering Packing
74AUP1T34GF 74AUP1T34GF,132
(935281321132)
Obsolete pQ SOT891
XSON6
(SOT891)
SOT891 SOT891_132

Environmental information

Type number Orderable part number Chemical content RoHS RHF-indicator
74AUP1T34GM 74AUP1T34GM,115 74AUP1T34GM rohs rhf rhf
74AUP1T34GM 74AUP1T34GM,132 74AUP1T34GM rohs rhf rhf
74AUP1T34GM-Q100 74AUP1T34GM‑Q100X 74AUP1T34GM-Q100 rohs rhf rhf
74AUP1T34GN 74AUP1T34GN,132 74AUP1T34GN rohs rhf rhf
74AUP1T34GS 74AUP1T34GS,132 74AUP1T34GS rohs rhf rhf
74AUP1T34GW 74AUP1T34GW,125 74AUP1T34GW rohs rhf rhf
74AUP1T34GW-Q100 74AUP1T34GW‑Q100H 74AUP1T34GW-Q100 rohs rhf rhf
74AUP1T34GX 74AUP1T34GXH 74AUP1T34GX rohs rhf rhf
74AUP1T34GZ 74AUP1T34GZYL 74AUP1T34GZ rohs rhf rhf
74AUP1T34GZ-Q100 74AUP1T34GZ‑Q100YL 74AUP1T34GZ-Q100 rohs rhf rhf

All type numbers in the table below are discontinued.

Type number Orderable part number Chemical content RoHS RHF-indicator
74AUP1T34GF 74AUP1T34GF,132 74AUP1T34GF rohs rhf rhf
Quality and reliability disclaimer

Documentation (37)

File name Title Type Date
74AUP1T34 Low-power dual supply translating buffer Data sheet 2024-09-23
AN10161 PicoGate Logic footprints Application note 2002-10-29
AN90063 Questions about package outline drawings Application note 2025-10-22
001aac538 Block diagram: 74AUP1T34GF, 74AUP1T34GM, 74AUP1T34GW Block diagram 2009-11-04
Nexperia_document_guide_Logic_translators Nexperia Logic Translators Brochure 2021-04-12
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
Nexperia_document_guide_MiniLogic_PicoGate_201901 PicoGate leaded logic portfolio guide Brochure 2019-01-07
SOT891 3D model for products with SOT891 package Design support 2019-10-03
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT1115 3D model for products with SOT1115 package Design support 2023-02-02
SOT1202 3D model for products with SOT1202 package Design support 2023-02-02
SOT353-1 3D model for products with SOT353-1 package Design support 2019-09-23
SOT1226-3 3D model for products with SOT1226-3 package Design support 2021-01-28
SOT8065-1 3D model for products with SOT8065-1 package Design support 2024-11-05
aup1t34 74AUP1T34 IBIS model IBIS model 2014-12-14
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 Leaflet 2019-04-12
Nexperia_document_leaflet_Logic_X2SON_packages_062018 X2SON ultra-small 4, 5, 6 & 8-pin leadless packages Leaflet 2018-06-05
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
Leaflet_SOT8065_Minilogic Leaflet_SOT8065 Minilogic Leaflet 2024-11-15
DFN1010-6_SOT891_mk plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 1 mm x 1 mm x 0.5 mm body Marcom graphics 2017-01-28
DFN1410-6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON6_SOT1115_mk plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 0.9 mm x 1 mm x 0.35 mm body Marcom graphics 2017-01-28
TSSOP5_SOT353-1_mk plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body Marcom graphics 2018-07-25
REFLOW_BG-BD-1 Reflow soldering profile Other type 2025-11-14
SOT891 plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1 mm x 0.5 mm body Package information 2020-04-21
SOT886 plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Package information 2022-06-01
SOT1115 plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body Package information 2022-05-27
SOT1202 plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body Package information 2022-06-01
SOT353-1 plastic thin shrink small outline package; 5 leads; body width 1.25 mm Package information 2022-11-15
SOT1226-3 plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mm Package information 2020-08-27
SOT8065-1 Plastic thermal enhanced extremely thin small outline package withside-wettable flanks (SWF); no leads; 5 terminals; body 1.1 × 0.85 × 0.5mm Package information 2024-09-24
MAR_SOT891 MAR_SOT891 Topmark Top marking 2013-06-03
MAR_SOT886 MAR_SOT886 Topmark Top marking 2013-06-03
MAR_SOT1115 MAR_SOT1115 Topmark Top marking 2013-06-03
MAR_SOT1202 MAR_SOT1202 Topmark Top marking 2013-06-03
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

Support

If you are in need of design/technical support, let us know and fill in the answer form we'll get back to you shortly.

Models

File name Title Type Date
SOT891 3D model for products with SOT891 package Design support 2019-10-03
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT1115 3D model for products with SOT1115 package Design support 2023-02-02
SOT1202 3D model for products with SOT1202 package Design support 2023-02-02
SOT353-1 3D model for products with SOT353-1 package Design support 2019-09-23
SOT1226-3 3D model for products with SOT1226-3 package Design support 2021-01-28
SOT8065-1 3D model for products with SOT8065-1 package Design support 2024-11-05
aup1t34 74AUP1T34 IBIS model IBIS model 2014-12-14

Sample

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