Celebrating 20 years of LFPAK!
Two decades ago, Nexperia transformed the semiconductor industry with a unique clip-bond package for power MOSFETs. This disruptive innovation was called LFPAK, offering the lowest power losses of any package type anywhere on the market. It was revolutionary, offering radical performance improvements that gave early adopters more than they dared hope for in a MOSFET package.
Backed by 20 years’ continuous innovation, the story continues…
How LFPAK became the de facto standard for high quality robust power packaging
Chris Boyce
Read moreChanging the industry
20 years ago Nexperia engineers had an innovative idea that would transform power MOSFETs. Two decades on, we ask the original pioneers of LFPAK copper-clip semiconductor packaging how it feels to have innovated technology which changed the landscape of a whole industry?
Going one step further
Nexperia doesn’t just develop high-performance power products and innovative power technologies. We also create the most advanced tools to provide knowledge, learning, and support for design engineers.
Learn more about our electrothermal MOSFET models, try out our interactive application notes, watch our quick learning videos or download the MOSFET and GaN FET Application Handbook: A Power Design Engineer’s Guide.